We specialize in automatic coverlay lamination equipment and high-precision inspection solutions. Leveraging over a decade of expertise in opto-mechatronics and machine vision technology, we deliver high-speed, high-precision lamination and defect detection. Our product portfolio includes VCP (Vertical Continuous Plating) production line series, IC substrate semiconductor plating lines, gantry/single-arm plating lines, gold finger plating lines, and more, widely serving leading PCB manufacturers.
We specialize in automatic coverlay lamination equipment and high-precision inspection solutions. Leveraging over a decade of expertise in opto-mechatronics and machine vision technology, we deliver high-speed, high-precision lamination and defect detection. Our product portfolio includes VCP (Vertical Continuous Plating) production line series, IC substrate semiconductor plating lines, gantry/single-arm plating lines, gold finger plating lines, and more, widely serving leading PCB manufacturers.
Existing VCP and gantry-type plating lines struggle with line width/space control accuracy. In high-density interconnection scenarios such as IC substrates and substrate-like PCBs (SLP), plating uniformity and pattern fidelity fall short of micron-level standards, resulting in yield loss and missed opportunities in premium orders.
Coverlay lamination, plating, and inspection equipment operate in isolation with poor data connectivity and intelligent coordination. Lengthy changeover and debugging times, combined with manual-dependent process parameter transfer, keep overall line OEE (Overall Equipment Effectiveness) low—failing to support the rapid product changeover and flexible manufacturing requirements of leading PCB enterprises.
Traditional post-plating and post-layup quality control relies mainly on offline sampling inspection, lacking high-speed online high-precision machine vision solutions. Late defect discovery, high miss rates, and the inability to build full-board quality data archives make it difficult to satisfy the quality traceability demands of high-reliability applications such as automotive electronics and servers.
PREV
NEXT
The assembly line has a built-in deep learning vision system, which captures defects such as PIN offset, warped feet, missed insertion, and virtual welding in real time, distinguishes between subtle process deviations and real defects, and the detection speed is not reduced by the addition of AI.
Traditional defect classification relies on manual re-judgment.The AI audit system of the PIN intelligent assembly line can automatically learn and adapt, quickly classify and grade defects, reduce misjudgment without slowing down the production line.
The assembly line integrates a high-precision measurement module to accurately measure PIN height, coplanarity, spacing and solder joint morphology.AI-driven contour modeling improves measurement accuracy and reliability, and helps manufacturers control process fluctuations.
AI fully interconnects the various stations, testing equipment and MES systems of the assembly line, drives cross-system data fusion and analysis, and generates real-time process response prediction, dynamic beat optimization, and intelligent production scheduling.
PREV
NEXT
The massive amount of data in the manufacturing process is analyzed in real time through the AI system to gain insight into trend deviations and abnormal patterns, provide full-link traceability, and promote continuous improvement and yield improvement.
AI migrates image processing and data computing to edge GPUs, reducing the hardware cost of traditional industrial computers, while improving computing power density and response speed.
The global service team uses AI predictive maintenance to identify equipment abnormalities in advance and provide customers with faster remote diagnosis and on-site support.
From process programming to daily operation and maintenance, AI automates and optimizes processes in all aspects to improve the efficiency and production capacity of engineers and operators.
PREV
NEXT
The assembly line has a built-in deep learning vision system, which captures defects such as PIN offset, warped feet, missed insertion, and virtual welding in real time, distinguishes between subtle process deviations and real defects, and the detection speed is not reduced by the addition of AI.
Traditional defect classification relies on manual re-judgment.The AI audit system of the PIN intelligent assembly line can automatically learn and adapt, quickly classify and grade defects, reduce misjudgment without slowing down the production line.
The assembly line integrates a high-precision measurement module to accurately measure PIN height, coplanarity, spacing and solder joint morphology.AI-driven contour modeling improves measurement accuracy and reliability, and helps manufacturers control process fluctuations.
AI fully interconnects the various stations, testing equipment and MES systems of the assembly line, drives cross-system data fusion and analysis, and generates real-time process response prediction, dynamic beat optimization, and intelligent production scheduling.
The massive amount of data in the manufacturing process is analyzed in real time through the AI system to gain insight into trend deviations and abnormal patterns, provide full-link traceability, and promote continuous improvement and yield improvement.
AI migrates image processing and data computing to edge GPUs, reducing the hardware cost of traditional industrial computers, while improving computing power density and response speed.
The global service team uses AI predictive maintenance to identify equipment abnormalities in advance and provide customers with faster remote diagnosis and on-site support.
From process programming to daily operation and maintenance, AI automates and optimizes processes in all aspects to improve the efficiency and production capacity of engineers and operators.
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